LifecyclePhase:
Revision : 4
Expired Period: Forever
Release Date:2013-05-06 14:02:32.0
DATASHEET
P-LED
32-01-T4C-4PRB
13
Copyright ? 2010, Everlight All Rights Reserved. Release Date : May.2. 2013 Issue No:   DPE-0000107
www.everlight.com
handsoldering at the lowest possible temperature is desirable for the LEDs.
n    Wave soldering parameter must be set and maintain according to recommended temperature and
dwell time in the solder wave.
4.  Cleaning
n    When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a
duration of no more than one minute. Dry at room temperature before use.
n    Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of
ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled
condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the
LED
5.  Circuit Protection
n    Below the zener reference voltage Vz, all the current flows through LED and as the voltage rises to
Vz, the zener diode breakdown." If the voltage tries to rise above Vz current flows through the
zener branch to keep the voltage at exactly Vz.
n    When the LED is connected using serial circuit, if either piece of LED is no light up but current
can t flow through causing others to light down. In new design, the LED is parallel with zener
diode. if either piece of LED is no light up but current can flow through causing others to light up.
6.  Heat Management
n    Heat management of LEDs must be taken into consideration during the design stage of LED
application. The current should be de-rated appropriately by referring to the de-rating curve found
in each product specification.
n    The temperature surrounding the LED in the application should be controlled. Please refer to the
data sheet de-rating curve.
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